Boyd and NVIDIA: Driving AI Cooling Innovation

The NVIDIA GB200 NVL72 platform sets new standards for AI and accelerated computing and demands robust, scalable thermal management. That is exactly what Boyd delivers.

As a Recommended Vendor for the GB200 NVL72 platform, Boyd provides dependable, production-ready cooling solutions for supporting architectures like NVIDIA MGX™ and the NVIDIA GB200 Grace Blackwell Superchip. Boyd enables reliable liquid cooling across the GB200 ecosystem, from liquid cold plates and blind mate quick disconnects to in-rack and in-row cooling distribution units (CDUs), helping customers scale efficiently and deploy with confidence.

Recognition From NVIDIA

NVIDIA evaluated Boyd’s thermal solutions and recognized their performance, reliability, and platform compatibility by adding Boyd to its Recommended Vendor List (RVL). This recognition reinforces Boyd’s proven readiness, trusted innovation, and ability to seamlessly and efficiently integrate into clients’ data centers.

As an RVL supplier, Boyd supplies validated thermal components for the GB200 NVL72 architecture. Customers count on Boyd’s NVIDIA-validated, production-ready solutions to streamline qualifications, minimize deployment risks, and accelerate system integration.

A Complete Cooling Suite for NVIDIA GB200 NVL72

Boyd supplies a full range of liquid cooling technologies tailored for high-performance, dense computing environments that support the NVIDIA GB200 NVL72 platform. Each solution emphasizes reliability, thermal efficiency, and system integration.

In-Row and In-Rack CDUs for NVIDIA MGX

Boyd delivers 1.1kW to 2.3kW in-row liquid-to-liquid CDUs for NVIDIA MGX architecture installations. We also offer in-rack CDU configurations with liquid-to-liquid and liquid-to-air options to address diverse thermal and infrastructure demands. These solutions support efficient, scalable cooling while optimizing serviceability and space within high-density racks.

High-Performance Cold Plates for GB200 Grace Blackwell Superchip

Boyd builds brazed copper cold plate assemblies for the GB200 Grace Blackwell Superchip with both left and right orientations to support diverse system layouts. We apply aluminum mounting to lower thermal resistance and boost heat transfer efficiency. Our reliable brazing process delivers durable, leak-tight performance for mission-critical applications.

Integrated Manifolds for GB200 NVL72: Inner vs. Rack Manifolds

In high-density systems, efficient liquid distribution plays a critical role. On the GB200 NVL72 platform, Boyd supports both inner manifold and rack manifold architectures, enabling fast, leak-free connections with blind mate quick disconnects (QDs).

What Is an Inner Manifold?

Inner manifolds distribute coolant directly to liquid cold plates or other internal components within the server chassis.

What Is a Rack Manifold?

Rack manifolds use a centralized fluid interface to distribute coolant at the rack level, supporting multiple systems from a single connection point.

Boyd designs blind mate QDs (quick disconnects) to work effortlessly with both types of manifolds. On NVIDIA’s GB200 Grace Blackwell Superchip platform, Boyd enables inner manifold connections with QDs that automatically couple without tools as servers slide into the chassis. On NVIDIA’s MGX platform, Boyd supports rack manifold connections with QDs that ensure fast and reliable engagement or disconnection during deployment and maintenance. In mission-critical cooling systems, these blind mate QDs ensure leak-free performance, simplify maintenance, and reduce downtime.

Boyd: Trusted Thermal Solutions Supporting NVIDIA

Boyd delivers production-ready thermal solutions verified for the NVIDIA GB200 NVL72 platform. Boyd enables efficient and scalable liquid cooling designed for the future of artificial intelligence and accelerated computing, including blind mate quick disconnects, precision cold plates, and in-row and in-rack CDUs.

As an NVIDIA Recommended Vendor, Boyd provides fully qualified, high-performance thermal systems that help customers deploy with confidence, reduce risk, and accelerate time to market. Collaborate with Boyd to maximize your NVIDIA GB200 deployment. Let’s design the future together.

Cooling AI & HPC: Unlocking Accelerated Computing Potential

Next-generation higher density AI and high-performance computing (HPC) platforms demand powerful thermal management. Effective cooling unlocks the full potential of cutting-edge NVIDIA AI infrastructure, redefining compute performance. Boyd addresses this challenge by designing advanced liquid cooling systems to support customers deploying NVIDIA accelerated computing infrastructure . From cold plates to manifolds and coolant distribution units (CDUs), Boyd customizes each of its thermal solutions to meet the unique demands of every application, delivering the performance, scalability, and reliability required for today’s most complex data-driven workloads.

Precision Liquid Cooling

Every AI or HPC deployment has unique cooling needs. Boyd takes a highly customized approach to thermal management, designing each liquid cooling solution to match the system’s form factor, power density, and performance objectives. Whether optimizing cold plate internal geometry for high-wattage GPUs and DPUs or designing manifolds that efficiently route coolant through dense server layouts, Boyd ensures every component enhances thermal performance without compromising space or energy efficiency.

By collaborating closely with design teams and system integrators, Boyd fine-tunes every element of the thermal interface to align precisely with NVIDIA’s MGX rack architecture for high density accelerated computing. This engineering precision minimizes pressure drop, lowers thermal resistance, and improves reliability in the most demanding compute environments.

Optimized Liquid Cooling: From Cold Plate to CDU

Boyd’s thermal engineers design liquid cooling for NVIDIA MGX architecture systems with a holistic focus. We integrate cold plates, manifolds, and coolant distribution units (CDUs) into a unified solution to maximize thermal efficiency and simplify deployment.

Manifolds direct coolant precisely across devices to reduce flow variation, while cold plates feature optimized internal geometries and flow paths to boost heat transfer at the source. CDUs regulate fluid temperature, pressure, and flow based on system load and ambient conditions. This integrated design enables Boyd to deliver compact, high-performance cooling systems that scale with the demands of next-generation AI and HPC platforms.

Seamless Integration: Boyd’s Co-Engineered Cooling for NVIDIA MGX Architecture

Boyd collaborates closely with customers building NVIDIA platforms to engineer application-specific cooling that keeps pace with rapid innovation. Our co-engineering support enables rapid prototyping, thermal modeling, and validation aligned with customer design cycles to meet aggressive launch timelines.

We team with system architects and integrators to ensure seamless integration with NVIDIA infrastructure. From early design through high-volume production, Boyd delivers scalable thermal solutions that unlock the full performance and reliability of next-generation AI technology.

Boyd: Advanced Thermal Management for Next-Gen AI & HPC

NVIDIA’s most advanced MGX architecture systems demand thermal systems engineered for peak performance and energy efficiency. Boyd meets this challenge with custom liquid cooling solutions including cold plates, manifolds, and CDUs, designed as unified systems that scale with evolving compute needs.

As AI and HPC continue to advance, Boyd supports NVIDIA-accelerated innovation with application-specific engineering, accelerated development, and scalable manufacturing. Let’s build cooling systems that will power the future. Connect with our experts to start your next thermal innovation.

Boyd ROL2300: Precision Cooling with Versatility

Boyd’s ROL2300 delivers flexible thermal performance. It is designed to reject heat loads up to 2.3 MW of heat at an 8°C approach temperature and 1.15 MW at a 4°C approach. This flexibility enables data center architects to adjust their cooling strategies to meet system requirements, whether they aim for high-precision thermal control or energy efficiency.

Boyd ROL2300: Compact Power, Easy Deployment

Boyd engineered the ROL2300 to deliver serious power in a compact footprint, helping data center operators maximize valuable floor space. Its in-row configuration allows them to service multiple racks with a single CDU while maintaining optimal density and easy access. Despite its high performance, the ROL2300 installs quickly, with clearly marked primary and secondary supply and return ports that simplify deployment.

Boyd ROL2300: Balancing AI Performance with Sustainability

The ROL2300 combines high cooling capacity with an energy-efficient design that lowers operating costs and reduces environmental impact. Its pump system delivers reliable flow control while the primary valve modulates to maintain a set fluid temperature. This consistent operation helps improve power usage effectiveness (PUE) and reduces unnecessary energy consumption, contributing to overall efficiency.

Its compact size helps data centers reduce their cooling footprint by minimizing the need for large infrastructure. These capabilities help operators support demanding AI workloads powered by NVIDIA technologies while aligning with long-term sustainability goals.

Boyd ROL2300: Uninterrupted Cooling, Maximized Uptime

The ROL2300 uses dual 30 HP pump sets to deliver high-performance flow and pressure, meeting the demands of dense, AI-optimized server racks supporting the NVIDIA GB200 NVL72 and future generations. These pumps maintain robust, steady coolant circulation through cold plates and manifolds, ensuring system-wide thermal stability even under severe thermal loads. Designed for continuous operation, the ROL2300 features hot-swappable filters that technicians service without impacting uptime, reducing risk in mission-critical deployments.

Boyd ROL2300: Scaling AI with Confidence

AI is advancing rapidly, and cooling must keep up. The ROL2300 delivers thermal performance, ease of use, and space efficiency data centers rely on to support next-generation computing, including systems powered by NVIDIA GB200 NVL72 and beyond. Boyd leverages decades of experience in liquid cooling design and manufacturing to help hyperscale and enterprise customers confidently scale their artificial intelligence infrastructure. Boyd continues to work together with NVIDIA to enable high-performance, efficient data center operations through advanced thermal solutions. Contact our experts today for end-to-end installation, maintenance, and customized cooling solutions tailored to your AI-driven data center.

Scaling Data Center Cooling

Chip-Level Liquid Cooling: Boyd’s Liquid Cold Plates (LCPs)

Increasing processing power generates more heat at the chip level. Traditional air cooling fails to keep up with high-power CPUs and GPUs, causing thermal throttling and lowering efficiency. Boyd’s liquid cold plates (LCPs) deliver direct liquid cooling for high-performance processors, efficiently dissipating heat and maintaining optimal operating temperatures.

Blade-Level Cooling: Boyd’s Liquid Cooling Loops (LCLs)

Boyd’s Rack-Level Liquid Cooling

Rack power densities are rising and efficiently cooling entire server racks is essential. Boyd’s liquid manifolds and in-rack Coolant Distribution Units (CDUs) distribute fluid across multiple servers and in-row CDUs distribute fluid across multiple racks. Boyd’s CDUs deliver reliable cooling for increasing power levels while reducing energy waste. Rack-level liquid cooling enhances energy efficiency to meet the growing thermal demands of AI and high-performance computing (HPC).

Boyd’s Thermal Modeling and Simulation

Maximizing cooling performance and energy efficiency throughout a facility requires a comprehensive strategy. Boyd’s sophisticated thermal modeling and simulation services help data center operators design cooling systems that optimize efficiency and scalability for increasing power densities. By examining each design choice in a liquid system, Boyd engineers create specialized cooling solutions that improve uptime and prolong the life of vital data center infrastructure.

Boyd: Lowering Data Center OPEX

Future of Data Center Cooling

According to a report by MarketsandMarkets, the global data center cooling market is projected to grow from USD 12.7 billion in 2023 to USD 29.6 billion by 2030, reflecting a compound annual growth rate (CAGR) of 12.8% during the forecast period. As power densities and AI workloads increase, data centers will adopt integrated liquid cooling solutions as the standard for next-generation infrastructure.

Boyd: Holistic Data Center Cooling

From microchips to megawatts, Boyd applies liquid cooling expertise to help data centers achieve peak performance, reliability, and energy efficiency. By optimizing cooling at the chip, rack, and facility levels, our holistic approach maximizes uptime and extends equipment lifespan. Contact us today to discuss your data center cooling needs and discover how Boyd’s innovative solutions enhance thermal management strategies.

Rising Trend: Miniaturized Semiconductor Components

As semiconductor geometries continue to shrink, advances in microelectronics are driving the development of powerful, smart, and sophisticated devices. This ongoing miniaturization trend propels semiconductor innovation, enabling the scale-down of intricate patterns on wafers essential to produce advanced semiconductor devices.

Advanced Chipmaking Technologies: Pushing the Limits of Moore’s Law

Advancements in fabrication techniques, especially extreme ultraviolet (EUV) and deep ultraviolet (DUV) lithography, are revolutionizing the semiconductor manufacturing process, enabling increasingly miniaturized and efficient semiconductor components with significant improvements in transistor density, performance, and energy efficiency.

Extreme ultraviolet (EUV) lithography is a cutting-edge semiconductor fabrication technique that employs very short wavelengths of 13.5 nm, which is 14 times smaller than the other advanced lithography technique, deep ultraviolet (DUV) lithography with wavelengths of 193 nm. Such short wavelengths enable microchip circuit and transistor production at extremely small nodes, such as 7nm and 5nm, achieving unprecedented precision and resolution levels in semiconductor manufacturing.

Semiconductor manufacturers continuously explore innovative cooling solutions such as liquid cooling, heat pipes, heat sinks, and advanced materials to dissipate growing heat levels from densely packed electronic components. Sustainable cooling innovation is required to unlock semiconductor technology’s fullest potential and enable continued advanced electronic device development.

Boyd and Innovative Cooling Technologies

Boyd has decades of experience and expertise innovating and manufacturing cooling solutions for semiconductors. Our customer-first service with market-leading speed and responsiveness combined with decades of semiconductor design expertise and robust, proprietary modeling tools enable us to iterate designs quickly and accelerate speed to market.

Boyd’s overlapping thermal technology portfolio enables liquid, two-phase, and air-cooling innovation to co-exist. Leverage our highly efficient, reliable, and sustainable liquid cooling systems to decrease test times, maximize temperature forcing range, or decrease chip operating temperature for faster processing and better uptimes. To learn more about our semiconductor cooling solutions or to discuss your project needs, schedule a consultation with our experts.

How Are Semiconductors Manufactured?

Billions of semiconductors enable the electronification of the world around us. What begins as a simple chemical element ends up powering everything from consumer electronics like calculators and mobile phones to advanced computer systems like self-driving cars and in-flight rocket controllers. Semiconductors store data, perform logic functions, and much more. But how do they go from purified silicon to enabling the entire interconnected, electronic world?

Creating Silicon Wafers

Semiconductor manufacturing begins with a simple element like silicon (often purified from sand or quartz). Once silicon is highly purified, it is shaped into a cylindrical crystalline ingot called a silicon boule. The boule is cut into very thin, uniform wafers with a wide range of different diameters depending on the boule size and required chip yield.

Each wafer is exposed to elements like boron or phosphorus in precise quantities in a process called semiconductor doping. This changes the electric properties of the material and allows semiconductors to accomplish different functions.

The doped silicon wafers are introduced to gases in a thermal processing system. While the specific deposition method may vary, the goal is always to produce an oxide layer on the wafer that protects the silicon surface, as any contaminants could interfere with the electrical current.

Photolithography and Thin Film Deposition

Depending on the use of the integrated circuit (IC), a complex system of integrated components such as transistors, diodes, capacitors, resistors, and more are transferred onto the wafer via photomasking. Once the circuit designs are traced onto the wafer, they are etched into it through wet etching (liquid etchants) or dry etching (plasma etchants).

While semiconductors are incredibly thin, they include dozens of layers of material stacked on top of one another from the photoresists and etching. A thin film of conductive and insulating layers is then added into the circuit pattern. Interconnects are attached to the wafer to electrically connect all the layers together.

Wafer Testing and Semiconductor Dicing

Now that the wafer is complete with the necessary interconnected circuits, it goes through initial testing. Wireless or wired automated test equipment (ATE) performs electronic die sorting (EDS) that includes circuit probing, repair processes, wafer burn-in, and more to identify faulty semiconductor chips along the wafer to remove them from yield once the semiconductor chips are cut out.

Semiconductor chips are finally individually cut from the wafer along predetermined lines via a blade in a process called semiconductor dicing. Depending on what the chip is being used for, it’s inserted into semiconductor test sockets to be tested for voltage, current, resistance, capacitance, and more.

Semiconductor Packaging

Passing semiconductors then go through the final stage of semiconductor production: integrated circuit (IC) packaging. The semiconductor chip is attached to bonding wires and encapsulated into a package made of plastic, ceramic, metal, or some combination. The package protects the delicate chip from corrosion, moisture ingress, and physical damage. Thermal and electromechanical solutions such as EMI shielding and heat transfer fins can also be incorporated into the packaging at this step.

Each integrated circuit package also contains an array of leads that are used to connect the IC to a circuit board. These are often made up of pins in a pin grid array (PGA), solder in a ball grid array (BGA), or flat no leads (QFN/DFN) packages depending on size and connectivity requirements. Recently, some IC packages have evolved into system in package (SiP) constructions, where multiple semiconductor chips are packaged together for a three-dimensional integrated circuit.

Finally, the integrated circuit packages are carefully packaged and sent to the end user, where they may undergo system level testing to test each chip in the context of where it will ultimately be used.

The Boyd Difference for Semiconductor Solutions

From unique temperature forcing equipment for semiconductor testing to the custom immersion cooling systems that cool processor chips in data centers, Boyd’s integrated circuit solutions help cool, seal, and protect nearly every aspect of the semiconductor industry. Boyd’s experts blend decades of experience working with leading semiconductor producers with cutting-edge innovation to enable higher processing power in smaller footprints.

If you have questions about Boyd’s semiconductor solutions, or would like to discuss your unique application, visit our website or schedule a consultation with our experts.

As global digitalization, artificial intelligence, and electronification rises sharply across all industries, data centers need faster, more powerful technology for increased processing and storage. Managing increased heat load from this rapid rise in processing power in a sustainable way is a top priority for hyperscale, enterprise, edge, colocation, and other data centers, which has driven many to turn to liquid cooling solutions.

Where air cooled systems used to suffice, liquid cooling systems are rising in popularity among data centers to sustainably manage increases in power while reducing carbon footprint. Boyd has years of experience designing Coolant Distribution Units (CDUs) for right–sized, efficient liquid cooling to meet the exact needs of hyperscale compute systems and provide optimal cooling performance. Boyd’s experts also offer end-to-end customized support to solve unique challenges faced by liquid cooling systems for enterprise applications.

Why Use a Coolant Distribution Unit (CDU) for Data Center Cooling?

Coolant Distribution Units are systems that enable efficient liquid cooling in a data center in row or at rack level. CDUs circulate coolant in a closed loop system to cool racks, chassis, blades, or down to the processors and memory. In data centers where conserving space is crucial, CDUs negate the need for large heat sinks, fan trays, and other necessary components in air-cooled systems, creating additional design space within a server rack to further increase power and process density. Design flexibility and customizability have made CDUs the superior option for data center liquid cooling.

There are two main types of CDUs:

In-Row CDUs are larger, freestanding, and designed to manage higher heat loads across a series of server chassis.

Boyd’s End-to-End Liquid Cooling Support

Boyd’s service team has years of experience supporting the installation of liquid cooled systems into data centers. From initial deployment to regular maintenance, Boyd’s experts are available globally to assure peak performance for the lifespan of the device.

Boyd supports customers through every phase of liquid cooling system deployment and operation: installation, commissioning, and servicing.

Installation Support:

One of the biggest concerns when implementing a liquid cooling system is ensuring that the liquid circuit is optimally filled with coolant and all air is evacuated from the system. If excess air remains, it can collect around the pump and reduce the lifespan of components inside the circuit.

While CDUs usually include small, built-in pumps for adding additional coolant, corrosion inhibitors, or other additives, these are usually too small for initial system fill. To expedite filling the liquid circuit and minimize downtime, Boyd has a wide variety of large axillary pumps available.

For large networks requiring a high volume of coolant, our experts can bring in external pumps to efficiently move coolant throughout the system. Not only does this save crucial space within the server by eliminating a permanent pump, it also exponentially decreases the time required to initially fill the system to deploy it as quickly as possible. The larger pump also ensures that no air is left in the system to potentially cause damage to sensitive components.

Commissioning:

Once a liquid cooling system is installed, it is critical to ensure that it is connected to the IT rack and the facility as a whole to mitigate potential problems. Boyd’s CDUs have gone through years of leak-free and condensation-free development and testing, but it is important to prepare for unlikely emergencies, like a system leak.

If there is a system leak, it is paramount to notify the CDU immediately to shut off the pump before liquid can damage any sensitive components. The CDU also needs to not only recognize that a leak occurred, but the specific location of the leak so that it can quickly be remedied.

We offer several ways to detect and prevent leaks depending on CDU construction. Built-in humidity and temperature sensors make sure that data centers operate below dew point to mitigate condensation risk on system piping. CDU lines are also insulated with inert neoprene to prevent any moisture accumulation should condensation occur.

System architects leverage wire sensors and pressure sensors to measure humidity and pressure for leak detection. For even more specificity, leak detection films can also immediately detect the location of a leak in various parts of the liquid circuit. These methods can be mixed and matched depending on the CDU construction and where the system is being installed.

Servicing:

Coolant Distribution Units require periodic preventative maintenance throughout the lifetime of the system to check for flow loss, pump life expectancy, power supply operation, and coolant quality.

Filters, pumps, and power supplies can be replaced proactively on a time-bound schedule or due to changes in flow or performance. To monitor coolant quality as it flows through the circuit, we can incorporate light emitting diodes (LEDs) in custom light trays along clear segments to quickly identify any foreign debris or loss of quality. If coolant needs to be replaced, topped off, or if there is any need for additives such as corrosion inhibitors, our team can quickly be on-site to fix any potential issues.

Our global presence allows us to have experts on location around the world to support needs ranging from spare part fulfillment, system service, and repair solutions to verify that our customers’ data center liquid cooling systems are performing optimally. Boyd also offers equipment and preventative maintenance training for on-site support staff.

From initial designs and deployment to proactive maintenance, Boyd’s service team has years of experience working on every aspect of custom liquid cooling solutions for data centers. Our global team looks at data center liquid cooling from an integrated perspective to lengthen system lifespans, increase overall reliability, and lower overall maintenance and repair costs.

Reach out to Boyd

To learn more about Boyd’s Coolant Distribution Units or to find out how we can tailor our service to best fit your data center requirements visit our CDU page or get in touch with our experts.

As nearly every industry employs devices and electronics that require increased power, more efficient cooling for high heat loads in compact spaces has never been more important. Boyd has decades of experience providing CDUs (Coolant Distribution Units) to help precisely cool and protect enterprise electronics and hyperscale, IOT, and cloud systems. We provide CDU solutions that are right-sized and custom-configured to help maintain uptime and lower total data center cost of ownership.

To help shed some light on incorporating a CDU into a data center cooling system, we sat down with one of our thermal experts to discuss some of the most important implementation considerations.

Why would you need a CDU for data center cooling?

Uninterrupted, 24/7 data center operation is critical for business continuity. As thermal requirements have increased along with computing power, many enterprise applications have surpassed what traditional air cooling can achieve. A CDU offers a higher level of cooling capacity in a more compact, flexible solution, and is an efficient option for cooling and protecting data center components.

How important is Hot Swapping? Do I need Hot Swapping features in my system?

Uptime for servers in a data center is crucial, so having hot-swappable components (or components that are replaceable during continued operation) can help avoid service disruptions. Boyd’s cooling distribution units have multiple components that are hot-swappable, including cold plates and pumps to help expedite system service and minimize maintenance downtime.

How do you prevent condensation and leaks in a CDU?

Any amount of condensation or liquid leaking from a cooling system can cause damage or failure to any of the equipment inside of a server rack. Temperature and humidity sensors are typically installed to ensure that the data center is operating below dew point to mitigate any condensation risk on system piping.

While Boyd’s Liquid Cooling Systems have been employed for over 30.6 billion field hours with no leaks, Boyd also installs leak detection systems to monitor potential leaks and provide alarms. In addition, CDU lines are insulated with an inert neoprene to prevent any moisture accumulation should condensation occur.

Do CDUs connect to facility water or facility air?

Whether self-contained in-row CDUs or integrated in-rack CDUs, cooling distribution units need to be connected to facility water or to the facility-level cooling system to dump heat. Boyd has several different heat exchangers to facilitate the transfer of heat out of a CDU, ranging from liquid-to-liquid systems to liquid-to-air systems.

While transferring heat out directly from the CDU to facility water provides the highest cooling capacity, it may not be necessary for all applications. Rear Door Heat Exchangers (RDHx) coupled with Reservoir Pumping Units (RPUs) are frequently used in conjunction as an economical solution to reject heat into the ambient air of a data center.

How do you increase the lifespan of a Coolant Distribution Unit?

Data centers usually have a 20-40% increase in computing power every five years, with equipment life expectancy lasting around ten years. This increase in power means a highly increased thermal load. A Cooling Distribution Unit should align with the same computing growth cycle and should expect a life expectancy between five and ten years.

Making sure that the CDU is well maintained is one of the best ways to increase the lifespan of a server chiller. Preventative maintenance is performed for loss of flow, pump life expectancy, and power supply operation. For flow changes, we can implement time-bound filter replacement, and replacement of the pumps and power supply unit can be triggered based on hours of operation.

It’s also important to use and maintain a high-quality coolant to extend the life of the internal filters. This helps prevent thermal runaway, which in turn can enhance the life of the pump and power supply.

Boyd has years of experience providing right-sized, custom-configured Coolant Distribution Units for optimal cooling performance. Learn more by visiting our CDU page, or reach out to us to learn more about our thermal solutions.