Boyd and NVIDIA: Driving AI Cooling Innovation The NVIDIA GB200 NVL72 platform sets new standards for AI and accelerated computing and demands robust, scalable thermal management. That is exactly what Boyd delivers. As a Recommended Vendor for the GB200 NVL72...
Cooling AI & HPC: Unlocking Accelerated Computing Potential Next-generation higher density AI and high-performance computing (HPC) platforms demand powerful thermal management. Effective cooling unlocks the full potential of cutting-edge NVIDIA AI infrastructure,...
Boyd ROL2300: High-Density AI Cooling As Artificial Intelligence (AI) servers grow denser and thermal loads increase, liquid cooling plays a crucial role in high-performance data center infrastructure. Boyd’s ROL2300 Coolant Distribution Unit (CDU) meets modern data...
Scaling Data Center Cooling Optimizing thermal management from the chip level to the facility level becomes essential as data centers scale to support increasing AI, cloud computing, and hyperscale workload demands. Efficient cooling ensures maximum performance,...
Rising Trend: Miniaturized Semiconductor Components As semiconductor geometries continue to shrink, advances in microelectronics are driving the development of powerful, smart, and sophisticated devices. This ongoing miniaturization trend propels semiconductor...
