The Future of AI: Powered by Efficient Cooling Artificial intelligence large language models are now surpassing 1 trillion parameters, making next-generation technology essential. This new era of AI-driven computing prioritizes power efficiency, acceleration,...
ARPA-E COOLERCHIPS: Greening Data Centers The ARPA-E COOLERCHIPS program tackles the challenge of developing advanced cooling technologies to reduce the environmental impact and cost of data centers. The consortium includes industry and academic experts: Boyd, NVIDIA,...
Beyond Performance: Addressing Reliability Concerns in Liquid Cooling In today’s advanced hyperscale data center landscape, liquid cooling systems are essential for next-generation performance. These systems push equipment density with liquid cooling loops...
Mastering IT Cooling: The Power of Liquid Cooling Solutions The ever-increasing demands of data center infrastructure management (DCIM) create a scorching challenge: heat. Traditional air-cooling struggles to keep pace, threatening data center performance and...
A $5 Million grant from the U.S. Department of Energy (DOE) supports NVIDIA and seven partners, including Boyd, to build an advanced liquid cooling system that enables a future class of efficient power-dense data centers. The DOE program, called COOLERCHIPS, focuses...
