ROL 1100 CDU: The Future of Liquid Cooling In today’s data-driven landscape, high-demand compute systems require reliable thermal management to maintain performance and extend longevity. Hyperscale data centers and advanced manufacturing environments depend on...
What Is Hyperscale Computing? Hyperscale computing scales architecture to meet increasing demand, powering the world’s largest data centers. These facilities manage massive amounts of data by processing and storing diverse data streams across countless servers....
ARPA-E COOLERCHIPS: Greening Data Centers The ARPA-E COOLERCHIPS program tackles the challenge of developing advanced cooling technologies to reduce the environmental impact and cost of data centers. The consortium includes industry and academic experts: Boyd, NVIDIA,...
Mastering IT Cooling: The Power of Liquid Cooling Solutions The ever-increasing demands of data center infrastructure management (DCIM) create a scorching challenge: heat. Traditional air-cooling struggles to keep pace, threatening data center performance and...
A $5 Million grant from the U.S. Department of Energy (DOE) supports NVIDIA and seven partners, including Boyd, to build an advanced liquid cooling system that enables a future class of efficient power-dense data centers. The DOE program, called COOLERCHIPS, focuses...
