Boyd Blog

Maximizing AI Data Center Cooling Efficiency with Boyd and NVIDIA Solutions

Scaling AI Data Centers: Overcoming Cooling Challenges AI data centers are scaling rapidly to meet the intense compute demands of generative models and large language model inference. These workloads, often accelerated by NVIDIA’s latest GPU architectures, drive...

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Benefits of Battery Immersion Cooling for EV and Data Centers

Beyond Conventional Cooling: Immersion TechnologyElectric vehicles (EVs) and data centers demand...

Beyond the Basics: Innovative Silicone Molding Uses

Silicone Molding: Driving Innovation Across Industries Silicone molding is essential for...

Surface Energy and Adhesive Selection

Surface Energy and Adhesive Selection

Mar 22, 2018 | Blog, Bonding and Adhesive Systems, Engineered Materials, Material Science

Pressure-sensitive adhesives (PSA) have made it possible to permanently adhere two dissimilar substrates together....

Advantages & Disadvantages of Standardizing O-Rings

Advantages & Disadvantages of Standardizing O-Rings

Mar 19, 2018 | Blog, Gaskets and O-Rings

Standardization of O-Ring Sizes When the O-Ring concept was originally developed, there was no standardization of...

How Hot is too Hot? The Real Maximum Temperature of Your Product

How Hot is too Hot? The Real Maximum Temperature of Your Product

Mar 12, 2018 | Blog, Design Engineering, Thermal

Summer is upon us and it brings some sweltering hot days with it. This is a great time of year to consider your next...

3D Laser Scanning at Boyd

3D Laser Scanning at Boyd

Feb 6, 2018 | Blog, Manufacturing Capabilities, Prototyping and Sampling

Imagine that you need to precisely measure a custom-machined, geometrically-complex wheel. Which measuring tool would...

We’re a Big Fan of Forced Convection

We’re a Big Fan of Forced Convection

Feb 5, 2018 | Blog, Extreme Air Cooling, Thermal

We're a Big Fan of Forced Convection In the thermal management industry, we are highly concerned with the convection...

What Boyd Genie Means: “Working Envelope” and Heat Sink Design Volume

What Boyd Genie Means: “Working Envelope” and Heat Sink Design Volume

Jan 22, 2018 | Blog, Software, Thermal

Space: the Final FrontierIn the "Project Conditions" page of Boyd Genie, there is a box that asks you the "Working...

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