Gaskets & O-Rings

Environmental Sealing & Protection

Bonding & Adhesive Systems

Human Machine Interfaces & Graphics

Insulation & Shielding

Health & Safety

Liquid Cooling

Two Phase Cooling

Extreme Air Cooling

Conduction Cooling

Sockets 75x75 1

Sockets

Foam

Adhesives

Metal Alloys

Fluids

Rubber

Plastics

Films

Fabrics

Graphite

Featured: Silicone

eMobility

Cloud

Medical

Semiconductor

Industrial Technology

5G

Mobile

Aerospace

Defense

Artificial Intelligence

Battery

Medical Wearables

HMI & Display

Test Systems

Energy Management

Automation

Leadership

ESG

Careers

News Icon 75x75 1

News

Resources

Locations

Help Center

Blog Icon 75x75 1

Blog

Choose Language
  • News
  • Contact Us
  • Help Center
Boyd | Trusted Innovation
  • Engineered Materials
  • Thermal
  • Material Science
  • Industries
  • Applications
  • About
Select Page

Home » liquid cooling systems » Page 2

Cooling High-Power Electronics

Cooling High-Power Electronics

Autonomous Compute and Artificial Intelligence, Blog, Liquid Cooling, Semiconductor, Thermal, Two Phase Cooling

Rise of Power: Increasing Power Demand for High-Performance Chips The semiconductor industry continues to drive Moore’s Law and push the boundaries of semiconductor chip power and performance. Higher performance, more powerful and complex chips generate more heat with...
Energy Consumption in Data Centers: Air versus Liquid Cooling

Energy Consumption in Data Centers: Air versus Liquid Cooling

Blog, Cloud Data Center, Extreme Air Cooling, Liquid Cooling, Thermal

Rising Energy Demand in Data Centers Growing demand for digital services, including cloud computing, artificial intelligence, and other data-intensive technologies is increasing global data center energy consumption. According to International Energy Agency (IEA),...
Next Entries »
  • About Boyd
  • Contact Us
  • Sitemap
  • Web Accessibility
  • Careers
  • Help Center
  • Find a Part Number
  • Terms & Conditions
  • Privacy Policy
Copyright © 2026 Boyd. All Rights Reserved.